XCVC1702-1MLINSVG1369 System On Chip (SoC)_Huizhong Dingtai_Passive Components_Memory Memory_Data Memory_Wires&Cables_Circuit Protection_Power Supply_Semiconductors_Optoelectronic Products_Sensors

XCVC1702-1MLINSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

：

XCVC1702-1MLINSVG1369

System On Chip (SoC)

Xilinx (AMD)

IC VERSAL AI-CO

Tray

: $25,261.2500

: 0

$25,261.2500

：

XCVC1702-1MLINSVG1369

：

Xilinx (AMD)

：

IC VERSAL AI-CO

：

Tray

：

YES

Product parameters

PDF(1)

TYPE	DESCRIPTION
Mfr	Xilinx (AMD)
Series	Versal™ AI Core
Package	Tray
Product Status	ACTIVE
Package / Case	1369-BFBGA, FCBGA
Speed	600MHz, 1.3GHz
RAM Size	256KB
Number of I/O	500
Operating Temperature	-40°C ~ 110°C (TJ)
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes	Versal™ AI Core FPGA, 1M Logic Cells
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DDR, DMA, PCIe
Supplier Device Package	1369-FCBGA (35x35)
Architecture	MPU, FPGA